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PC845XJ0000F series 1 sheet no.: d2-a08501en date sep. 1. 2006 ? sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of con rmation by device speci cation sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device speci cation sheets before using any sharp device. PC845XJ0000F series dip 16pin (4-channel) darlington phototransistor output, photocoupler description PC845XJ0000F series contains an ired optically coupled to a phototransistor. it is packaged in a 4-channel package, available in smt gullwing lead-form option. input-output isolation voltage(rms) is 5.0 kv. ctr is min. to 600% at input current of 1.0 ma. features 1. 6pin dip 4-channnel package 2. double transfer mold package (ldeal for flow soldering) 3. darlington phototransistor output (ctr : min. 50% at i f = 1.0 ma, v ce = 2 v) 4. high isolation voltage between input and output (v iso(rms) : 5.0 kv) 5. lead-free and rohs directive compliant agency approvals/compliance 1. recognized by ul1577 (double protection isolation), le no. e64380 (as model no. pc845 ) 2. approved by vde, din en60747-5-2 ( ? ) (as an option), le no. 40008087 (as model no. pc845 ) 3. package resin : ul ammability grade (94v-0)) ( ? ) din en60747-5-2 : successor standard of din vde0884. applications 1. home appliances 2. programmable controller 3. signal transmission between circuits of different potentials and impedances ? 1-channel package type is also available. (model no. pc815xj0000f series )
2 sheet no.: d2-a08501en PC845XJ0000F series internal connection diagram outline dimensions (unit : mm) 123 4 5 6 7 8 anode cathode emitter collector 2 4 6 8 10 12 14 16 9 11 13 15 1 3 5 7 16 15 14 13 12 11 10 9 1. through-hole [ ex. PC845XJ0000F ] pc815 pc815 pc815 pc815 7.62 0.30 : 0 to 13 ? 19.82 0.50 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 anode mark factory identification mark date code 2.54 0.25 123 4 5 6 7 8 11 10 13 14 15 16 12 9 product mass : approx. 1.0g 2. smt gullwing lead-form [ex. pc845xij000f ] pc815 pc815 pc815 pc815 7.62 0.30 19.82 0.50 3.5 0.5 6.5 0.5 0.6 0.2 1.2 0.3 date code 2.54 0.25 0.26 0.10 epoxy resin 1.0 + 0.4 ? 0.0 1.0 + 0.4 ? 0.0 10.0 + 0.0 ? 0.5 0.35 0.25 1 2 3 4 5 6 7 8 11 10 13 14 15 16 12 9 factory identification mark anode mark product mass : approx. 0.9g
3 sheet no.: d2-a08501en PC845XJ0000F series 3. through-hole (vde option) [ex. pc845xyj000f ] (unit : mm) pc815 pc815 pc815 pc815 7.62 0.30 : 0 to 13 ? 19.82 0.50 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 anode mark factory identification mark date code 2.54 0.25 123 4 5 6 7 8 11 10 13 14 15 16 12 9 4 4 4 4 sharp mark "s" vde indenfication mark product mass : approx. 1.0g plating material : sncu (cu : typ. 2%) 4. smt gullwing lead-form (vde option) [ex. pc845xiyj00f ] pc815 pc815 pc815 pc815 7.62 0.30 19.82 0.50 3.5 0.5 6.5 0.5 0.6 0.2 1.2 0.3 date code 2.54 0.25 0.26 0.10 epoxy resin 1.0 + 0.4 ? 0.0 1.0 + 0.4 ? 0.0 10.0 + 0.0 ? 0.5 0.35 0.25 1 2 3 4 5 6 7 8 11 10 13 14 15 16 12 9 factory identification mark anode mark sharp mark "s" vde indenfication mark 4 4 4 4 product mass : approx. 0.9g
4 sheet no.: d2-a08501en PC845XJ0000F series repeats in a 20 year cycle rank mark there is no rank mark indicator. 1st digit 2nd digit year of production month of production a.d. mark a.d. mark month mark 1990 a 2002 p january 1 1991 b 2003 r february 2 1992 c 2004 s march 3 1993 d 2005 t april 4 1994 e 2006 u may 5 1995 f 2007 v june 6 1996 h 2008 w july 7 1997 j 2009 x august 8 1998 k 2010 a september 9 1999 l 2011 b october o 2000 m 2012 c november n 2001 n : : december d date code (2 digit) factory identi cation mark country of origin no mark japan indonesia china * this factory marking is for identi cation purpose only. please contact the local sharp sales representative to see the actural status of the production. factory identi cation mark
5 sheet no.: d2-a08501en PC845XJ0000F series absolute maximum ratings electro-optical characteristics (t a = 25 ? c ) parameter symbol rating unit input forward current i f 50 ma *1 peak forward current i fm 1a reverse voltage v r 6v power dissipation p 70 mw output collector-emitter voltage v ceo 35 v emitter-collector voltage v eco 6v collector current i c 80 ma collector power dissipation p c 150 mw total power dissipation p tot 200 mw operating temperature t opr ? 30 to + 100 ? c storage temperature t stg ? 55 to + 125 ? c *2 isolation voltage v iso(rms) 5kv *3 soldering temperature t sol 270 ? c *1 pulse width 100ms, duty ratio : 0.001 *2 40 to 60%rh, ac for 1minute, f=60hz *3 for 10s (t a = 25 ? c) parameter symbol condition min. typ. max. unit input forward voltage v f i f = 20ma ? 1.2 1.4 v peak forward voltage v fm i fm = 0.5v ?? 3.0 v reverse current i r v r = 4v ?? 10 a terminal capacitance c t v = 0, f = 1khz ? 30 250 pf output collector dark current i ceo v ce = 10v, i f = 0 ?? 1 000 na collector-emitter breakdown voltage bv ceo i c = 0.1ma, i f = 035 ?? v emitter-collector breakdown voltage bv eco i e = 10 a, i f = 06 ?? v transfer charac- teristics current transfer ratio i c i f = 1ma, v ce = 2v 6.0 16.0 75.0 ma collector-emitter saturation voltage v ce(sat) i f = 20ma, i c = 5ma ? 0.8 1.0 v isolation resistance r iso dc500v, 40 to 60%rh 5 10 10 1 10 11 ? floating capacitance c f v = 0, f = 1mhz ? 0.6 1.0 pf cut-off frequency f c v ce = 2v, i c = 2ma, r l = 100 , ? 3db 1 6 ? khz response time rise time t r v ce = 2v, i c = 10ma, r l = 100 ? 60 300 s fall time t f ? 53 250 s
6 sheet no.: d2-a08501en PC845XJ0000F series model line-up please contact a local sharp sales representative to inquire about production status. lead form through-hole smt gullwing form package sleeve 25pcs/sleeve din en60747-5-2 ? approved ? approved model no. PC845XJ0000F pc845xyj000f pc845xij000f pc845xiyj00f
7 sheet no.: d2-a08501en PC845XJ0000F series fig.5 peak forward current vs. duty ratio fig.6 current transfer ratio vs. forward current forward current i f (ma) ambient temperature t a ( ? c) 0 50 40 30 20 10 30 0 25 50 55 75 100 125 diode power dissipation p (mw) ambient temperature t a ( ? c) 0 100 80 70 60 40 20 30 0 25 50 55 75 100 125 collector power dissipation p c (mw) ambient temperature t a ( ? c) 0 250 200 150 100 50 30 0 25 50 75 100 125 total power dissipation p tot (mw) ambient temperature t a ( ? c) 0 250 200 150 100 50 30 0 25 50 75 100 125 duty ratio pulse width b 100 m s t a 25 ? c 10 100 10 3 10 2 10 1 peak forward current i fm (ma) 1 10 000 1 000 current transfer ratio ctr (%) forward current i f (ma) 0.1 1 10 0 2 000 1 800 1 600 1 400 400 600 800 1 000 1 200 200 v ce 2v t a 25 ? c fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature fig.1 forward current vs. ambient temperature fig.2 diode power dissipation vs. ambient temperature
8 sheet no.: d2-a08501en PC845XJ0000F series fig.7 forward current vs. forward voltage fig.8 collector current vs. collector-emitter voltage fig.9 relative current transfer ratio vs. ambient temperature fig.10 collector - emitter saturation voltage vs. ambient temperature fig.11 collector dark current vs. ambient temperature fig.12 collector-emitter saturation voltage vs. forward current 50 ? c 25 ? c 0 ? c 0 0.5 1 1.5 2 2.5 3 3.5 10 100 1 25 ? c t a 75 ? c forward current i f (ma) forward voltage v f (v) 0 01234 100 90 80 70 60 50 40 30 20 10 5 5ma 2ma 1ma collector current i c (ma) collector-emitter voltage v ce (v) i f 10ma p c (max.) t a 25 ? c relative current transfer ratio ( ) 0 150 100 50 ambient temperature t a ( ? c) i f 1ma v ce 2v 30 0 0 0 0 0 0 0 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 collector-emitter saturation voltage v ce (sat) (v) i f 20ma i c 5ma ambient temperature t a ( ? c) 30 0 0 0 0 0 0 collector dark current i ceo (a) 10 5 10 6 10 7 10 8 10 9 10 10 10 11 80 60 40 30 0 20 100 ambient temperature t a ( ? c) v ce 10v collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 8 7 6 5 4 3 2 1 7ma 50ma 30ma 1ma 3ma 5ma i c 0.5ma t a 25 ? c 4 3.5 3 2.5 2 1.5 1 0.5 0
9 sheet no.: d2-a08501en PC845XJ0000F series fig.11 response time vs. load resistance fig.12 test circuit for response time fig.13 frequency response fig.14 test circuit for frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. v cc 90 % 10 % t d t r t r t s output input r l input r d output v ce please refer to the conditions in fig.13 1 0.1 1 100 10 v ce 2v i c 10ma t a 25 ? c t f t r t d t s response time ( m s) load resistance r l (k 7 ) 0.1 0.01 20 10 0 10 1 1k 7 100 7 100 r l 10k 7 v ce 2v i c 2ma t a 25 ? c voltage gain a v (db) frequency f (khz) v cc r l output r d v ce please refer to the conditions in fig.15
10 sheet no.: d2-a08501en PC845XJ0000F series design considerations design guide while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) (unit : mm) 2.2 2.54 2.54 2.54 2.54 2.54 2.54 2.54 1.7 8.2 ? for additional design assistance, please review our corresponding optoelectronic application notes.
11 sheet no.: d2-a08501en PC845XJ0000F series manufacturing guidelines soldering method re ow soldering: re ow soldering should follow the temperature pro le shown below. soldering should not exceed the curve of temperature pro le and time. please don't solder more than twice. flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270 ? c and within 10s. preheating is within the bounds of 100 to 150 ? c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400 ? c. please don't solder more than twice. other notice please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 1234 300 200 100 0 0 ( ? c) terminal : 260 ? c peak ( package surface : 250 ? c peak) preheat 150 to 180 ? c, 120s or less reflow 220 ? c or more, 60s or less (min)
12 sheet no.: d2-a08501en PC845XJ0000F series cleaning instructions solvent cleaning : solvent temperature should be 45 ? c or below. immersion time should be 3 minutes or less. ultrasonic cleaning : the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials : ethyl alcohol, methyl alcohol and isopropyl alcohol. in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. presence of odc this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) speci c brominated ame retardants such as the pbb and pbde are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde).
13 sheet no.: d2-a08501en PC845XJ0000F series package speci cation sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 25 pcs. of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) 12.0 6.7 5.8 10.8 520 p 2
14 sheet no.: d2-a08501en PC845XJ0000F series important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the speci cations, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used speci ed in the relevant speci cation sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- of ce automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traf c signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this publication. [e245]

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